Not to be confused with Intel Parallel Studio XE or Intel Xeon.

Intel Xe
Release dateSeptember 2, 2020; 3 years ago (2020-09-02)
Manufactured byIntel
TSMC
Designed byIntel
Marketed byIntel
Fabrication processTSMC N6
Cards
Entry-levelIris Xe Graphics
High-endIntel Arc
History
PredecessorGen 11
SuccessorIntel Xe 2

Intel Xe (stylized as Xe and pronounced as two separate letters,[1] abbreviation for "eXascale for everyone"[2]), earlier known unofficially as Gen12,[3][4] is a GPU architecture developed by Intel.[5]

Intel Xe includes a new instruction set architecture. The Xe GPU family consists of a series of microarchitectures, ranging from integrated/low power (Xe-LP),[6] to enthusiast/high performance gaming (Xe-HPG), datacenter/high performance (Xe-HP) and high performance computing (Xe-HPC).[7][8]

History

Intel's first attempt at a dedicated graphics card was the Intel740,[9] released in February 1998. The Intel740 was considered unsuccessful due to its performance which was lower than market expectations, causing Intel to cease development on future discrete graphics products. However, its technology lived on in the Intel Extreme Graphics lineup.[10] Intel made another attempt with the Larrabee architecture before canceling it in 2009;[11] this time, the technology developed was used in the Xeon Phi, which was discontinued in 2020.[12]

In April 2018, it was reported that Intel was assembling a team to develop discrete graphics processing units, targeting both datacenters, as well as the PC gaming market, and therefore competitive with products from both Nvidia and AMD.[13] Rumors supporting the claim included that the company had vacancies for over 100 graphics-related jobs, and had taken on former Radeon Technologies Group (AMD) leader Raja Koduri in late 2017 – the new product was reported to be codenamed "Arctic Sound".[13] The project was reported to have initially been targeting video streaming chips for data centers, but had its scope expanded to include desktop GPUs.[13]

In June 2018, Intel confirmed it planned to launch a discrete GPU in 2020.[14]

The first functional discrete "Xe" GPU, codenamed "DG1", was reported as having begun testing in October 2019.[15]

According to a report by Hexus in late 2019, a discrete GPU would launch in mid 2020; combined GPU/CPU (GPGPU) products were also expected, for data center and autonomous driving applications. The product was expected to initially be built on a 10 nm node (with 7 nm products in 2021) and use Intel's Foveros die stacking packaging technology (see 3D die stacking).[16] During 2020, the first GPUs were released under the name Intel Iris Xe Max, being integrated in the 11th generation Intel Core processors (codenamed "Tiger Lake" and "Rocket Lake"),[4] followed in 2021 by the Iris Xe DG1 card, exclusive to Intel OEM manufacturers.[17] Finally and after some delays, the retail launch of these first discrete graphics cards from the company in over 20 years, known as the Intel Arc series, would occur during 2022.[18]

Architecture

Intel Xe expands upon the microarchitectural overhaul introduced in Gen 11 with a full refactor of the instruction set architecture.[19][4] While Xe is a family of architectures, each variant has significant differences from each other as these are made with their targets in mind. The Xe GPU family consists of Xe-LP, Xe-HP, Xe-HPC, and Xe-HPG sub-architectures.

Unlike previous Intel graphics processing units which used the Execution Unit (EU) as a compute unit, Xe-HPG and Xe-HPC use the Xe-core.[20] This is similar to an Xe-LP subslice.[20] An Xe-core contains vector and matrix arithmetic logic units, which are referred to as vector and matrix engines. Other components include L1 cache and other hardware.[20][21]

Xe-LP (Low Power)

Xe-LP is the low power variant of the Xe architecture with removed support for FP64.[22] Xe-LP is present as integrated graphics for 11th-generation Intel Core and the Iris Xe MAX mobile dedicated GPU (codenamed DG1),[6] as well as in the H3C XG310 Intel Server GPU (codenamed SG1).[4] Compared to its predecessor, Xe-LP includes new features such as Sampler Feedback,[23] Dual Queue Support,[24] DirectX12 View Instancing Tier2,[25] and AV1 8-bit and 10-bit fixed-function hardware decoding.[26]

Xe-HP (High Performance)

Xe-HP is the datacenter/high performance variant of Xe, optimized for FP64 performance and multi-tile scalability.[5]

Xe-HPC (High Performance Compute)

Xe-HPC is the high performance computing variant of the Xe architecture.[7][8] An Xe-HPC Xe-core contains 8 vector and 8 matrix engines, alongside a large 512  KB L1 cache.[27] It powers Ponte Vecchio.

Xe-HPG (High Performance Graphics)

Xe-HPG is the enthusiast or high performance graphics variant of the Xe architecture. The microarchitecture is based on Xe-LP with improvements from Xe-HP and Xe-HPC.[28] The microarchitecture is focused on graphics performance and supports hardware-accelerated ray tracing,[7][29] DisplayPort 2.0,[30] XeSS or supersampling based on neural networks (similar to Nvidia DLSS), and DirectX 12 Ultimate. [31] Intel confirmed ASTC support has been removed from hardware starting with Alchemist and future Intel Arc GPU microarchitectures will also not support it.[32] An Xe-HPG Xe-core contains 16 vector engines and 16 matrix engines.[21] An Xe-HPG render slice will consist of four Xe-cores, ray tracing hardware, and other components.[21]

Xe-LPG (Low Power Graphics)

The Xe-LPG architecture is a low power variant of Xe-HPG designed for the tile-based iGPUs (tGPUs) of Intel's Meteor Lake and upcoming Arrow Lake processors. It is based on the same Arc Alchemist graphics (Gen 12.7) used by Intel's Arc A-series graphics cards but is optimized for operation with lower wattage and higher performance per watt.

Intel Xe 2

Intel Xe 2
Release date2024 or later
CodenameBattlemage
History
PredecessorIntel Xe
SuccessorIntel Xe 3

A successor to Xe was revealed during Intel Architecture Day 2021, under the name of Xe 2, codenamed Battlemage. It is currently under development.[21] In an exclusive interview with HardwareLuxx Tom Peterson confirmed that Xe2 will be segmented into "Xe2-LPG" (Low Power Graphics) for integrated GPUs and "Xe2-HPG" (High Performance Graphics) for discrete GPUs.[33]

Intel Xe 3

Intel Xe 3
CodenameCelestial
History
PredecessorIntel Xe 2
SuccessorIntel Xe 4

Intel Xe 3 is the upcoming successor to the Intel Xe 2 microarchitecture codenamed Celestial.[21]

Intel Xe 4

Intel Xe 4
CodenameDruid
History
PredecessorIntel Xe 3

Intel Xe 4 is the upcoming successor to the Intel Xe 3 microarchitecture codenamed Druid.[34]

Products using Xe

Integrated graphics

See also: Intel Graphics Technology

Newer Intel processors use the Xe-LP microarchitecture. These include 11th generation Intel Core processors (codenamed "Tiger Lake" and "Rocket Lake"),[4] 12th generation Intel Core processors (codenamed "Alder Lake"), and 13th generation Intel Core processors (codenamed "Raptor Lake").

Discrete graphics

Intel Iris Xe Max (DG1)

Model Launch Process Execution

units

Shading

units

Clock speeds Memory Processing power (GFLOPS) Notes
Boost clock

(MHz)

Memory

(MT/s)

Size

(GB)

Bandwidth

(GB/s)

Bus

type

Bus width

(bit)

Half Single Double INT8
Iris Xe MAX November 1, 2020 Intel 10SF 96 768 1650 4266 4 68 LPDDR4x 128 5069 2534 — 10138  

In August 2020, Intel was reported to be shipping Xe DG1 GPUs for a possible late 2020 release, while also commenting on a DG2 GPU aimed at the enthusiast market (later found out to be the first generation of Intel Arc nicknamed "Alchemist"). The DG1 is also sold as the Iris Xe MAX and as Iris Xe Graphics (stylized as iRIS Xe) in laptops, while cards for developers are sold as the DG1 SDV.[35][36]

The Xe MAX is an entry-level GPU that was first released on November 1, 2020, in China and is similar in most aspects to the integrated GPU found in Tiger Lake processors, the only differences being a higher clock speed, slightly higher performance and dedicated memory and a dedicated TDP requirement. It competes with Nvidia's laptop-level GeForce MX series GPUs. It is aimed at slim and highly portable productivity laptops and has 4GB of dedicated LPDDR4X-4266 memory with a 128-bit wide memory bus, has 96 EUs, 48 texture units, 24 ROPs, a peak clock speed of 1650 MHz and a performance of 2.46 FP32 teraFLOPs with a 25w TDP. By comparison, the integrated GPU in Tiger Lake processors has a performance of 2.1 FP32 teraFLOPs.[37][38] The Xe MAX does not replace the system's integrated GPU; instead it was designed to work alongside it, so tasks are split between the integrated and discrete GPUs.[39] It was initially available on only 3 laptops: The Asus VivoBook Flip 14 TP470, the Acer Swift 3X, and the Dell Inspiron 15 7000. Intel Xe MAX GPUs can only be found on systems with Tiger Lake processors.

Intel officially announced Intel Iris Xe Graphics desktop cards for OEMs and system integrators on January 26, 2021. It is aimed at mainstream desktop and business PCs as an improvement over other graphics options in AV1 video decoding, HDR (high dynamic range) video support and deep learning inference, and is not as powerful as its laptop counterpart, with only 80 enabled EUs. The first cards are made by Asus, have DisplayPort 1.4, HDMI 2.0, Dual Link DL-DVI-D outputs and are passively cooled.[40][41][42][43]

Intel Arc

Intel Arc is a high-performance discrete graphics line optimized for gaming. This will compete directly with the Radeon and GeForce lines of graphics processing units. The first generation (codenamed "Alchemist"), was developed under the "DG2" name and is based on the Xe-HPG architecture. Future generations are codenamed Battlemage ("DG3", based on Xe2), Celestial ("DG4", based on Xe3), and Druid ("DG5").

Desktop
Branding and Model[44] Launch MSRP
(USD) 		Code name Process Transistors (billion) Die size
(mm2) 		Core config [a] L2 cache Clock rate
(MHz)[b] 		Fillrate Memory Processing power (TFLOPS) TDP Bus
interface
Pixel
(GP/s) 		Texture
(GT/s) 		Type Size (GB) Bandwidth
(GB/s) 		Bus width Clock
(MT/s) 		Half
precision
(base) 		Single
precision
(base) 		Double
precision
(base)
Arc 3 A310 Sep 28, 2022 $110 ACM-G11
(DG2-128) 		TSMC
N6 		7.2 157 6 Xe cores
768:32:16:6
(192:96:2) 		4 MB 2000
2000 		32 64 GDDR6 4 GB 124 64-bit 15500 6.144 3.072 0.768 75 W PCIe 4.0 x8
A380 Jun 14, 2022 $139 8 Xe cores
1024:64:32:8
(256:128:2) 		2000
2050 		64
65.6 		128
131.2 		6 GB 186 96-bit 8.192
8.3968 		4.096
4.1984 		1.024
1.0496
Arc 5 A580 Oct 10, 2023 $179 ACM-G10
(DG2-512) 		21.7 406 24 Xe cores
3072:192:96:24
(768:384:6) 		8 MB 1700
1700 		163.2 326.4 8 GB 512 256-bit 16000 20.890 10.445 2.611 175 W PCIe 4.0 x16
Arc 7 A750 Oct 14, 2022 $289 28 Xe cores
3584:192:112:28
(896:448:7) 		12 MB 2050
2400 		229.6
268.8 		393.6
460.8 		29.3888
34.4064 		14.6944
17.2032 		3.6736
4.3008 		225 W
A770 8GB $329 32 Xe cores
4096:256:128:32
(1024:512:8) 		16 MB 2100
2400 		268.8
307.2 		537.6
614.4 		34.4064
39.3216 		17.2032
19.6608 		4.3008
4.9152
A770 16GB $349 16 GB 560 17500
  1. ^ Shading cores (ALU): texture mapping units (TMU): render output units (ROP): ray tracing units
       (tensor cores (XMX): execution units: render slices)
  2. ^ Boost values (if available) are stated below the base value in italic.
Mobile
Branding and Model[45] Launch Code name Process Transistors (billion) Die size
(mm2) 		Core config[a][b] L2
cache 		Core clock
(MHz)[c] 		Fillrate[d] Memory Processing power (TFLOPS) TDP Bus
interface
Pixel
(GP/s) 		Texture
(GT/s) 		Type Size Bandwidth
(GB/s) 		Bus width Clock
(MT/s) 		Half
precision 		Single
precision 		Double
precision
Arc 3 A350M Mar 30, 2022 ACM-G11
(DG2-128) 		TSMC
N6 		7.2 157 6 Xe cores
768:48:24:6
(96:96:2) 		4 MB 1150
2200 		27.6
52.8 		55.2
105.6 		GDDR6 4 GB 112 64-bit 14000 3.5328
6.7584 		1.7664
3.3792 		0.4416
0.8448 		25–35 W PCIe 4.0 ×8
A370M 8 Xe cores
1024:64:32:8
(128:128:2) 		1550
2050 		49.6
65.6 		99.2
131.2 		6.3488
8.3968 		3.1744
4.1984 		0.7936
1.0496 		35–50 W
Arc 5 A530M Q3 2023 ACM-G12
(DG2-256) 		12 Xe cores
1536:96:48:12
(192:192:3) 		8 MB 1300 4 GB
8 GB 		224 128-bit 65–95 W
A550M Q2 2022 ACM-G10
(DG2-512) 		21.7 406 16 Xe cores
2048:128:64:16
(256:256:4) 		900
1700 		57.6
108.8 		115.2
217.6 		8 GB 7.3728
13.9264 		3.6864
6.9632 		0.9216
1.7408 		60–80 W
A570M Q3 2023 ACM-G12
(DG2-256) 		1300 75–95 W
Arc 7 A730M Q2 2022 ACM-G10
(DG2-512) 		21.7 406 24 Xe cores
3072:192:96:24
(384:384:6) 		12 MB 1100
2050 		105.6
196.8 		211.2
393.6 		12 GB 336 192-bit 13.5168
25.1904 		6.7584
12.5952 		1.6896
3.1488 		80–120 W PCIe 4.0 ×16
A770M 32 Xe cores
4096:256:128:32
(512:512:8) 		16 MB 1650
2050 		211.2
262.4 		422.4
524.8 		16 GB 512 256-bit 16000 27.0336
33.5872 		13.5168
16.7936 		3.3792
4.1984 		120–150 W
  1. ^ Shading cores (ALU): texture mapping units (TMU): render output units (ROP): ray tracing units
       (tensor cores (XMX): execution units: render slices)
  2. ^ Texture fillrate is calculated as the number of texture mapping units (TMUs) multiplied by the base (or boost) core clock speed.
  3. ^ Boost values (if available) are stated below the base value in italic.
  4. ^ Pixel fillrate is calculated as the lowest of three numbers: number of ROPs multiplied by the base core clock speed, number of rasterizers multiplied by the number of fragments they can generate per rasterizer multiplied by the base core clock speed, and the number of streaming multiprocessors multiplied by the number of fragments per clock that they can output multiplied by the base clock rate.
Workstation
Branding and Model[46] Launch Code name Process Transistors (billion) Die size
(mm2) 		Core config[a] L2
cache 		Core clock
(MHz)[b] 		Fillrate[c][d] Memory Processing power (TFLOPS) TDP Bus
interface
Pixel
(GP/s) 		Texture
(GT/s) 		Type Size Bandwidth
(GB/s) 		Bus width Clock
(MT/s) 		Half
precision 		Single
precision 		Double
precision
Arc Pro A30M
(Mobile) 		Aug 8, 2022 ACM-G11
(DG2-128) 		TSMC
N6 		7.2 157 8 Xe cores
1024:64:32:8
(128:128:2) 		4 MB 1550 GDDR6 4 GB 112 64-bit 14000
4.20[46] 		50 W PCIe 4.0 x8
A40 6 GB 192 96-bit 16000
5.02[46]
A50 2050 75 W
A60M
(Mobile) 		June 6, 2023 ACM-G12
(DG2-256) 		16 Xe cores
2048:128:64:16
(256:256:4) 		1300 8 GB 256 128-bit
9.42[46] 		95 W PCIe 4.0 x16
A60 12 GB 384 192-bit
10.04[46] 		130 W
  1. ^ Shading cores (ALU): texture mapping units (TMU): render output units (ROP): ray tracing units
       (tensor cores (XMX): execution Units: render slices)
  2. ^ Boost values (if available) are stated below the base value in italic.
  3. ^ Pixel fillrate is calculated as the lowest of three numbers: number of ROPs multiplied by the base core clock speed, number of rasterizers multiplied by the number of fragments they can generate per rasterizer multiplied by the base core clock speed, and the number of streaming multiprocessors multiplied by the number of fragments per clock that they can output multiplied by the base clock rate.
  4. ^ Texture fillrate is calculated as the number of texture mapping units (TMUs) multiplied by the base (or boost) core clock speed.

Datacenter

Intel H3C XG310

On November 11, 2020 Intel launched the H3C XG310 data center GPU consisting of four DG1 GPUs with 32GB of LPDDR4X memory on a single-slot PCIe card.[47][48] Each GPU is connected to 8GB of memory over a 128-bit bus and the card uses a PCIe 3.0 x16 connection to the rest of the system. The GPUs use the Xe-LP (Gen 12.1) architecture.

Ponte Vecchio

Intel officially announced their Xe general HPC/AI GPU codenamed Ponte Vecchio on November 17, 2019. It was revealed to use the Xe-HPC variant of the architecture[49] and Intel's 'Embedded Multi-Die Interconnect Bridge' (EMIB) and Foveros die stacking packaging on a Intel 4 node (previously referred to as 7 nm). Intel later confirmed at Architecture Day 2021 that Ponte Vecchio would use Compute Tiles manufactured on TSMC N5, Base Tiles and Rambo Cache Tiles manufactured using Intel 7 (previously referred to as 10 nm Enhanced SuperFin) and Xe Link Tiles manufactured on the TSMC N7 process. The new GPU is expected to be used in Argonne National Laboratory's new exascale supercomputer, Aurora, with compute nodes comprising two next generation Intel Xeon (codenamed "Sapphire Rapids") CPUs, and six Ponte Vecchio GPUs.[50][51]

Model[52][53] Launch Code name(s) Process Transistors (billion) Die size
(mm2) 		Core config[a] Cache Core clock
(MHz)[b] 		Fillrate[c][d] Memory Processing power (TFLOPS) TDP Bus
interface
L1 L2 Pixel
(GP/s) 		Texture
(GT/s) 		Type Size Bandwidth
(GB/s) 		Bus width Clock
(MT/s) 		Bfloat16 Single
precision 		Double
precision
Data Center GPU Max 1100 Jan 10, 2023 Xe-HPC
(Ponte Vecchio) 		Multiple[54] 100 1280 7168:448:0:56:448:448 28 MB 204 MB 1000
1550 		0 448.0
694.4 		HBM2E 48 GB 1228.8 3072-bit 3200
352		 14.336
22.221 		300 W PCIe 5.0 x16
Data Center GPU Max 1350 abandoned 14336:896:0:112:896:896 56 MB 408 MB 750
1550 		672.0
1388.8 		96 GB 2457.6 6144-bit
704		 21.504
44.442 		450 W
Data Center GPU Max 1550 Jan 10, 2023 16384:1024:0:128:1024:1024 64 MB 408 MB 900
1600 		921.6
1638.4 		128 GB 3276.8 8192-bit
832		 29.491
54.423 		600 W
  1. ^ shading cores (ALU):texture mapping units (TMU):render output units (ROP):ray tracing units:tensor cores (XMX):execution Units
  2. ^ Boost values (if available) are stated below the base value in italic.
  3. ^ Pixel fillrate is calculated as the lowest of three numbers: number of ROPs multiplied by the base core clock speed, number of rasterizers multiplied by the number of fragments they can generate per rasterizer multiplied by the base core clock speed, and the number of streaming multiprocessors multiplied by the number of fragments per clock that they can output multiplied by the base clock rate.
  4. ^ Texture fillrate is calculated as the number of texture mapping units (TMUs) multiplied by the base (or boost) core clock speed.

Rialto Bridge

Intel officially announced the successor to Ponte Vecchio, GPU codenamed Rialto Bridge on May 31, 2022.[55] On March 3, 2023 Intel announced the discontinuation of Rialto Bridge in favor of their tile-based flexible and scalable Falcon Shores XPU (CPU + GPU) set to arrive in 2025.[56]

Arctic Sound

Under the codename Arctic Sound Intel developed data center GPUs for visual cloud and AI inference based on the Xe-HP architecture (Gen 12.5).[57] The GPUs were supposed to be fabbed on Intel's 10nm node and have a die size of around 190 mm2 with 8 billion transistors.[58] Up to four GPUs tiles could be combined into a single package together with HBM2e memory. In October 2021 Raja Koduri announced that Xe-HP won't be commercialized into a final product.[57] Instead the Arctic Sound cards will be based on the Xe-HPG architecture (Gen 12.7), the same as the Alchemist consumer graphics cards.[59] They were launched on August 24, 2022 as the Intel Data Center GPU Flex series. On March 3, 2023 Intel announced that it would discontinue the development of Lancaster Sound which was supposed to succeed Arctic Sound in 2023 with incremental improvements. Instead Intel will accelerate the development of Melville Sound which will be a significant architectural leap in terms of performance and features.[56]

See also

References

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source: http://en.wikipedia.org/wiki/Intel_Xe